- State-of-the-art technologies and newest
machinery for best quality products
and lowest manufacturing cost.
- Our two flexible, high capacity production lines
are used for electronic assembly and lead-free
soldering in a nitrogen reflow atmosphere.
Basic processes on both lines are:
Automatic SMD paste or glue assembly,
THT assembly of axial and radial components.
Reflow soldering in a convection oven and wave soldering,
lead-free alloys.
SMD Components ranging from 0201 to 45x45 mm
BGA, µBGA, Flip Chips, pitch 0,4mm.
Line 1 capacity:
11000 SMD components/h,
3000 THT components/h.
Line 2 capacity:
18000 SMD components/h,
5000 THT components/h.
- In addition to our Electronic Manufacturing facility
we have a well equipped Mechanical Department
and state-of-the-art Injection Moulding Department.
Metal component processing:
cutting, blanking, pressing, milling,
turning, bending, grinding.
Injection moulding of plastics:
ABS, PP, PA, PC, PE, PVC, PS and other plastics.
Capacity of the injection moulding machines:
up to 1000 injections/h.
Clamping force up to 1000 kN.
Weight of moulded pieces up to 200g.
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